Tape-out Service

    UDS has powerful team resources; we can not only provide turnkey service that from chip-design to tape out but also provide COT customer with tape out service for chip-design/GDS-in program and all kinds of technical supports including IP merge, LVS, etc. For the new products, we can provide the most economic MPW service. The processes are from 180nm to 28nm and the technologies include Logic/Mixed-Signal/RF/Low Power, etc. Besides, we can help clients to test & correct DRC/DFM and estimate ESD capability, etc.

2017 Shuttle Schedule

2017 Shuttle Plan

Technology

Jan

Feb

Mar

Apr

May

Jun

Jul

Aug

Sep

Oct

Nov

Dec

14nm

     

V

           

V

 

28nm

   

V

   

V

   

V

   

V

40nm

V

 

V

V

 

V

V

V

 

V

V

 

55/65nm

V

V

 

V

V

 

V

V

 

V

   

90nm

     

V

 

V

   

V

     

0.11um (AL)

V

 

V

 

V

V

V

 

V

 

V

V

0.11um/0.13um

   

V

     

V

     

V

 

0.15um

 

V

 

V

 

V

 

V

 

V

 

V

0.18um

 

V

 

V

 

V

 

V

V

V

 

V

0.35um

 

V

 

V

     

V

 

V

 

V

2018 Shuttle Schedule

2018 Shuttle Plan

Technology

Jan

Feb

Mar

Apr

May

Jun

Jul

Aug

Sep

Oct

Nov

Dec

28nm

   

V

V

   

V

V

 

V

V

 

40nm

V

V

V

 

V

V

V

 

V

V

V

 

55/65nm

V

 

V

V

   

V

V

 

V

V

 

90nm

   

V

 

V

     

V

     

0.11um (AL)

V

 

V

 

V

 

V

 

V

 

V

 

0.11um/0.13um

   

V

     

V

 

V

 

V

 

0.15um

 

V

 

V

 

V

V

V

 

V

 

V

0.18um

 

V

V

V

V

 

V

V

 

V

V

 

0.35um

   

V

   

V

   

V

   

V

  • TEL:86-0531-68613688

    FAX:86-0531-68613699
  • Mail:HR@UnitedDS.com

    Web:www.UnitedDS.com

  •  | Sitemap | 版权隐私 | 网站备案号: 鲁ICP备17006077号-1 
  • UDS is a professional semi-conductor design service company which is supported by UMC Group.
    © UnitedDS Semiconductor(Shandong)Co.,Ltd.